The 6th International Conference on Communications, Signal Processing, and Systems (CSPS)

July 14-16 2017, Harbin, China

Sponsored by:

IEEE Fort Worth Section, USA

IEEE Women in Engineering of Harbin Section, China

University of Texas at Arlington, USA

Harbin Institute of Technology, China

Tianjin Normal University, China

University of Electronic Science and Technology, China

Beijing University of Posts and Telecommunications, China

Shanghai Jiaotong University, China

 

The 6th International Conference on Communications, Signal Processing, and Systems (CSPS) will be held in July 2017 in Harbin, China. Prospective authors are invited to submit original technical papers for oral or poster presentations at CSPS and publication in the Conference Proceedings. The papers in communications, signal processing, and systems are solicited in the following topics, but are not limited to:

  • Wireless communications
  • Wireless networks
  • Optical communications and networks
  • Internet of Things
  • Wireless sensor networks
  • Wireless mesh networks
  • Ad hoc networks
  • Underwater sensor networks
  • Network security
  • Testbed of communications and networks
  • Information theory and coding
  • Multimedia communications
  • Smart grid
  • Radar signal processing
  • Audio and acoustic signal processing
  • Bio imaging and signal processing
  • Design and implementation of signal processing systems
  • Image, video and multidimensional signal processing
  • Industry technology tracks
  • Information forensics and security
  • Machine learning for signal processing
  • Multimedia signal processing
  • Sensor array and multichannel signal processing
  • Signal processing education
  • Signal processing for communications and networking
  • Signal processing theory and methods
  • Speech processing
  • Spoken language processing
  • Analog Signal Processing
  • Genomics Signal Processing
  • Biomedical and Life-Science Circuits, Systems and Applications
  • Circuits and Systems for Communications
  • Computer-Aided Network Design
  • Digital Signal Processing
  • Education in Circuits and Systems
  • Live Demonstrations of Circuits and Systems
  • Multimedia Systems and Applications
  • Nanoelectronics and Gigascale Systems
  • Neural Networks and Systems
  • Fuzzy Logic Systems
  • Nonlinear Circuits and Systems
  • Power and Energy Circuits and Systems
  • Sensory Systems
  • Radar Systems
  • Chaos Systems
  • Visual Signal Processing and Communications
  • VLSI Systems and Applications
  • Satellite and Space Communications

All accepted papers will be published in Lecture Notes in Electrical Engineering, a book series published by Springer, and is indexed by EI-indexed, ISI Proceedings, SCOPUS, MetaPress, Springerlink.

The 1st, 2nd, 3rd, 4th, and 5th International Conference on Communications, Signal Processing, and Systems (CSPS) were held in Beijing in October 2012, in Tianjin in September 2013, in Hohhot in July 2014, in Chengdu in October 2015, in Chongqing in October 2016, respectively. In the previous four conferences, more than 180 papers (after further extension) were selected into the following 11 SCI journals.

•       EURASIP Journal on Wireless Communications and Networking

•       Wiley Security and Communication Networks (SCN) Journal

•       International Journal of Sensor Networks

•       EURASIP Journal on Advances in Signal Processing

•       (Elsevier) Physical Communications

•       (Elsevier) Signal Processing

•       (Elsevier) Ad Hoc Networks

•       (Elsevier) Pattern Recognition

•       Mobile Information Systems

•       International Journal of Distributed Sensor Networks

It is expected that similar number of papers will be selected into SCI journals in 2017 CSPS conference.

All submissions should be written in English with a maximum paper length of eight (8) printed pages including figures without incurring additional page charges.

Standard Springer book templates are available for both LaTeX  and Microsoft Word format.

Please be aware that Springer book template size is much smaller than that of IEEE template (almost half size).

 Only PDF files will be accepted for the review process and all submissions must be done through EDAS.

 

Important Dates

Paper Submission Deadline:  April 20th, 2017May 15th, 2017 June 15th, 2017

Acceptance Notification:  June 15th, 2017

Camera Ready Paper: July 1st, 2017

 

General Co-Chairs:

Qing Guo, Harbin Institute of Technology, China

Tariq S. Durrani, University of Strathclyde, UK

Qilian Liang, University of Texas at Arlington, USA

Yiming Pi, University of Electronic Science and Technology, China

Baoju Zhang, Tianjin Normal University, China

 

 

TPC Co-Chairs:

Min Jia, Harbin Institute of Technology, China

Jing Liang, University of Electronic Science and Technology, China

Jeonghwan Jeon, Gyeongsang National University, Korea

Wei Wang, Tianjin Normal University, China

Jiasong Mu, Tianjin Normal University, China

Yue Wang, Tianjin Normal University, China

 

 

International Advisory Committee

Tieniu Tan, Chinese Academy of Science, China

Gene Frantz, Texas Instruments, USA

Er Meng Hwa, Nanyang Technological University, Singapore

Sanjit Mitra, University of Southern California, USA

Zhisheng Niu, Tsinghua University, China

Gengxin Zhang, PLA University of Science and Technology, China

Xuemai Gu, Harbin Institute of Technology, China

Zhongzhao Zhang, Harbin Institute of Technology, China

Qun Wu, Harbin Institute of Technology, China

Wan-Chi Siu, Hong Kong Polytechnic University, Hong Kong

Xiaorong Wu, Tianjin Normal University, China 

Zheng Zhou, Beijing University of Posts and Telecommunications, China

Qingsheng Zeng, Communication Research Centre of Canada, Canada

Yonghui Li, The University of Sydney, Australia

Wei Xiang, James Cook University, Australia

Zhiqiang Wu, Wright State University,USA

 

Publication Co-Chairs:

Wei Wang, Zhejiang University, China

Yue Wang, Tianjin Normal University, China

Chungang Yang, Xidian University, China

Jingchao Wang, Institute of China Electronic Equipment System Engineering Corporation, China

Nan Zhao, Dalian University of Technology, China

Xin Liu, Dalian University of Technology, China

Shenghong Li, Shanghai Jiaotong University, China

Kanglian Zhao, Nanjing University, China

Qian Sun, Tianjin University, China

Xuhong Feng, Tianjin Normal University, China

 

Publicity Co-Chair:

Weixiao Meng, Harbin Institute of Technology, China

Zongjie Cao, University of Electronic Science and Technology, China

Zheng Dou, Harbin Engineering University, China

Weixia Zou, Beijing University of Posts and Telecommunications, China

 

Keynote Co-Chairs

Xuejun Sha, Harbin Institute of Technology, China

Qinyu Zhang, Harbin Institute of Technology (Shen Zhen), China

Xiaorong Wu, Tianjin Normal University, China

Jean X. Gao, University of Texas at Arlington, USA

Chenglin Zhao, Beijing University of Posts and Telecommunications, China

 

Local Arrangement Co-Chairs:

Honglin Zhao, Harbin Institute of Technology, China

Zhutian Yang, Harbin Institute of Technology, China

Yun Lin, Harbin Engineering University, China

Bo Li, Harbin Institute of Technology(Wei Hai), China

Rui Min, University of Electronic Science and Technology, China

Shubin Wang, Inner Mongolia University, China

 

 

Registration & Financial Co-Chairs:

Zhihua Yang, Harbin Institute of Technology(Shen Zhen), China

Tingting Zhang, Harbin Institute of Technology(Shen Zhen), China

Wei Wu, Harbin Institute of Technology, China

Yupeng Li, Tianjin Normal University, China

Gongliang Liu, Harbin Institute of Technology (Wei Hai), China