Due to many requests, we would like to inform you that the
submission deadline of CSPS2018 has been extended to June 20th,2018. Please
submit your paper as soon as possible.
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For Paper
The 7th International Conference on Communications, Signal Processing, and Systems (CSPS)
July 14-16 2018, Dalian, China
Sponsored by:
IEEE Fort Worth Section, USA
IEEE Women in Engineering of Harbin Section, China
University of Texas at Arlington, USA
Dalian University of Technology, China
Dalian Maritime University, China
Tianjin Normal University, China
Harbin Institute of Technology, China
University of Electronic Science and Technology, China
Beijing University of Posts and Telecommunications, China
Shanghai Jiaotong University, China
The 7th International Conference on Communications, Signal Processing, and Systems (CSPS) will be held in July 2018 in Dalian, China. Prospective authors are invited to submit original technical papers for oral or poster presentations at CSPS and publication in the Conference Proceedings. The papers in communications, signal processing, and systems are solicited in the following topics, but are not limited to:
All accepted papers will be published in Lecture Notes in Electrical Engineering, a book series published by Springer, and is indexed by EI-indexed, ISI Proceedings, SCOPUS, MetaPress, Springerlink.
The 1st, 2nd, 3rd, 4th, 5th and 6th International Conference on Communications, Signal Processing, and Systems (CSPS) were held in Beijing in October 2012, in Tianjin in September 2013, in Hohhot in July 2014, in Chengdu in October 2015, in Chongqing in October 2016, in Harbin in July 2017 respectively. In the previous six conferences, more than 280 papers (after further extension) were selected into the following 10 SCI journals.
•EURASIP Journal on Wireless Communications and Networking
•Wiley Security and Communication Networks (SCN) Journal
•International Journal of Sensor Networks
•EURASIP Journal on Advances in Signal Processing
•(Elsevier) Physical Communications
•(Elsevier) Signal Processing
•(Elsevier) Ad Hoc Networks
•(Elsevier) Pattern Recognition
•Mobile Information Systems
•International Journal of Distributed Sensor Networks
It is expected that similar number of papers will be selected into SCI journals in 2018 CSPS conference.
Submission:
All submissions should be written in English with a maximum paper length of eight (8) printed pages including figures without incurring additional page charges.
Standard Springer book templates are available for both LaTeX and Microsoft Word format.
Please be aware that Springer book template size is much smaller than that of IEEE template (almost half size).
Only PDF files will be accepted for the review process and all submissions must be done through EDAS.
Authors can use the link below for submission:
https://easychair.org/conferences/?conf=csps2018
Important Dates:
Paper Submission Deadline: April 20th, 2018,May 31st ,2018,June 20th,2018
Acceptance Notification: June 15th, 2018
Camera Ready Paper: July 1st, 2018
General Co-Chairs:
Hongyu Wang, Dalian University of Technology, China
Sheng Bi, Dalian Maritime University, China
Tariq S. Durrani, University of Strathclyde, UK
Qilian Liang, University of Texas at Arlington, USA
Yiming Pi, University of Electronic Science and Technology, China
Baoju Zhang, Tianjin Normal University, China
TPC Co-Chairs:
Xin Liu, Dalian University of Technology, China
Wei Wang, Tianjin Normal University, China
Min Jia, Harbin Institute of Technology, China
Zhenyu Na, Dalian Maritime University, China
Jing Liang, University of Electronic Science and Technology, China
Jiasong Mu, Tianjin Normal University, China
Xuemai Gu, Harbin Institute of Technology, China
Zan Li, Xidian University, China
Qihui WU, Nanjing University of Aeronautics and Astronautics, China
Shi Jin, Southeast University, China
Mugen Peng, Beijing University of Posts and Telecommunications
Feifei Gao, Tsinghua University, China
Peng Li, Dalian Polytechnic University, China
International Advisory Committee:
Tieniu Tan, Chinese Academy of Science, China
Victor C.M. Leung,University of British Columbia, Canada
Kat-Kit Wong, University College London, UK
Gene Frantz, Texas Instruments, USA
ErMeng Hwa, Nanyang Technological University, Singapore
ZhishengNiu, Tsinghua University, China
Qing Guo, Harbin Institute of Technology, China
Wan-Chi Siu, Hong Kong Polytechnic University, Hong Kong
Arumugam Nallanathan, King’s College London, UK
Yan Zhang, University of Oslo, Norway
F. Richard Yu, Carleton University, Canada
Yunfei Chen, University of Warwick, UK
Hongjian Sun,Durham University, UK
Wei Xu, Southeast University, China
Publication Co-Chairs:
Yue Wang, Tianjin Normal University, China
YulongZou, Nanjing University of Posts and Telecommunications, China
Hui Li, Hainan University, China
Guoru Ding, Southeast University, China
Xiaoming Chen, Zhejiang University, China
Yueling Che, Shenzhen University, China
Su Hu, University of Electronic Science and Technology of China, China
Xinlin Huang, Tongji University, China
Yun Lin, Harbin University of Engineering, China
Jie Tang, South China University of Technology, China
Chungang Yang, Xidian University, China
Feng Shu, Nanjing University of Science and Technology, China
Qinghe Du, Xi'an Jiaotong University, China
Wei Wang, Zhejiang University, China
Publicity Co-Chair:
Guan Gui, Nanjing University of Posts and Telecommunications, China
Liang Xiao, Xiamen University, China
Xiaopeng Yang, Beijing Institute of Technology, China
Gongliang Liu, Harbin Institute of Technology (Weihai), China
Haijun Zhang, University of Science & Technology Beijing, China
Qingquan Sun, California State University San Bernardino, USA
Xiaofei Zhang, Nanjing University of Aeronautics and Astronautics, China
Zilong Liu, Nanyang Technological University, Singapore
Yuan Zhou, Tianjin University, China
Yong Li, Tsinghua University, China
Jingjiang Wang, Qingdao University of Science and Technology, China
Ning Wang, Zhengzhou University, China
YunjianJia, Chongqing University, China
Qingjiang Shi, Nanjing University of Aeronautics and Astronautics, China
Keynote Co-Chairs
Jean X. Gao, University of Texas at Arlington, USA
Shenghong Li, Shanghai Jiaotong University, China
Haibo Zhou, Naijing University, China
Lei Chen, Georgia Southern University, USA
Weijie Xia, Nanjing University of Aeronautics and Astronautics, China
Yong Zeng, National University of Singapore, Singapore
Tingting Zhang, Harbin Institute of Technology (Shenzhen), China
Jun Li, Nanjing University of Science and Technology, China
Jingyu Hua, Zhejiang University of Technology, China
Weigang Chen, Tianjin University, China
Rong Chai, Chongqing University of Posts and Telecommunications
Lusheng Wang, HeFei University of Technology, China
Yanjing Sun, China University of Mining and Technology, China
Rongfei
Fan, Beijing Institute of Technology, China
Ling
Yu, Army Engineering University of PLA
Jiachen
Sun, Army Engineering University of PLA
Local Arrangement Co-Chairs:
Minglu Jin, Dalian University of Technology, China
Nan Zhao, Dalian University of Technology, China
Xufen Xie, Dalian Polytechnic University, China
Jie wang, Dalian University of Technology, China
Hui Li, Dalian University of Technology, China
Registration & Financial Co-Chairs:
Liang Han, Tianjin Normal University, China
Yi Sun, Dalian University of Technology, China
Yanqing Guo, Dalian University of Technology, China
Ming Li, Dalian University of Technology, China
Bo Wang, Dalian University of Technology, China