Call For Paper
The 8th International
Conference on Communications, Signal Processing, and Systems (CSPS)
July 20-22 2019, Urumqi, China
Sponsored by:
IEEE Fort
Worth Section, USA
IEEE Women in Engineering
of Harbin Section, China
University of Texas at Arlington, USA
University of Strathclyde, UK
Xinjiang Normal University, China
Tianjin Normal University, China
Dalian University of Technology, China
Dalian Maritime University, China
Lanzhou Jiaotong University, China
Harbin Institute of Technology, China
University of Electronic Science
and Technology, China
Beijing University of Posts
and Telecommunications, China
Shanghai Jiaotong University, China
The 8th International Conference on Communications, Signal
Processing, and Systems (CSPS) will be held in July 2019 in Urumqi, China.
Prospective authors are invited to submit original technical papers for oral or
poster presentations at CSPS and publication in the Conference Proceedings. The
papers in communications, signal processing, and systems are solicited in the
following topics, but are not limited to:
All accepted papers will be published in Lecture Notes in Electrical
Engineering, a book series published by Springer, and is indexed by EI-indexed,
ISI Proceedings, SCOPUS, MetaPress, Springerlink.
The 1st, 2nd, 3rd, 4th, 5th 6th and 7th International Conference on
Communications, Signal Processing, and Systems (CSPS) were held in Beijing in
October 2012, in Tianjin in September 2013, in Hohhot in July 2014, in Chengdu
in October 2015, in Chongqing in October 2016, in Harbin in July 2017, in
Dalian in July 2018 respectively. In the previous seven conferences, more than
350 papers (after further extension) were selected into the following 10 SCI
journals.
•EURASIP Journal on Wireless Communications and Networking
•Wiley Security and Communication Networks (SCN) Journal
•International Journal of Sensor Networks
•Radio Engineering
•EURASIP Journal on Advances in Signal Processing
•(Elsevier) Physical Communications
•(Elsevier) Signal Processing
•(Elsevier) Ad Hoc Networks
•(Elsevier) Pattern Recognition
•Mobile Information Systems
•International Journal of Distributed Sensor Networks
It is expected that similar number of papers will be selected into SCI
journals in 2019 CSPS conference.
Submission:
All submissions should be written in English with a maximum paper length
of eight (8) printed pages including figures without incurring additional page
charges.
Standard Springer book templates are available for both LaTeX and
Microsoft Word format.
Please be aware that Springer book template size is much smaller than that
of IEEE template (almost half size).
Only PDF files will be accepted for the review process and all submissions
must be done through EasyChair.
Authors can use the link below
for submission:
https://easychair.org/conferences/?conf=csps2019
Important Dates:
Paper Submission Deadline: April
20th, 2019 June 20th, 2019
Acceptance Notification: June
30th, 2019
Camera Ready Paper: July 10th, 2019
General Co-Chairs:
Tariq S. Durrani, University of Strathclyde, UK
Ziwei Gao, Xinjiang
Normal University ,China
Weimin Pan, Xinjiang
Normal University, China
Qilian
Liang, University of Texas at Arlington, USA
Yiming Pi, University of Electronic Science
and Technology, China
Baoju Zhang, Tianjin Normal University, China
TPC Co-Chairs:
Bingcai Chen, Xinjiang Normal University, China
Qian Ning, Xinjiang
Normal University, China
Dongmei Xie, Xinjiang
Normal University, China
Min Jia, Harbin Institute of Technology, China
Xin Liu, Dalian University of Technology, China
Wei Wang, Tianjin Normal University, China
Jing Liang, University of Electronic Science
and Technology, China
Feng Zhao, Yulin Normal University, China
Zhenyu Na, Dalian Maritime University, China
Xiaoqiang Chen,Lanzhou Jiaotong University， China
Jiasong Mu, Tianjin Normal University, China
Xuemai Gu, Harbin Institute of Technology, China
Zan Li, Xidian University, China
Qihui Wu, Nanjing University of Aeronautics and Astronautics, China
Qinyu Zhang，Harbin Institute of
Technology, China
Shi Jin, Southeast University, China
Mugen Peng, Beijing University of Posts and Telecommunications
Feifei Gao, Tsinghua University, China
International Advisory Committee:
Tieniu Tan, Chinese Academy of Science, China
Victor C.M. Leung,University of British Columbia, Canada
Kat-Kit Wong, University College London, UK
Gene Frantz, Texas Instruments, USA
ErMeng Hwa, Nanyang Technological University, Singapore
ZhishengNiu, Tsinghua University, China
Qing Guo, Harbin Institute of Technology, China
Wan-Chi Siu, Hong Kong Polytechnic University, Hong
Kong
Arumugam Nallanathan, King’s College London, UK
Yan Zhang, University of Oslo, Norway
F. Richard Yu, Carleton University, Canada
Yunfei Chen, University of Warwick, UK
Hongjian Sun,Durham University, UK
Wei Xu, Southeast University, China
Publication Co-Chairs:
Yue Wang, Tianjin Normal University, China
Zuo Sun, Beijing University of Posts and
Telecommunications, China
YulongZou, Nanjing University of Posts and Telecommunications, China
Hui Li, Hainan University, China
Guoru Ding, Southeast University, China
Xiaoming Chen, Zhejiang University, China
Yueling Che, Shenzhen University, China
Su Hu, University of Electronic Science and Technology of China, China
Xinlin Huang, Tongji University, China
Yun Lin, Harbin University of Engineering, China
Jie Tang, South China University of Technology, China
Chungang Yang, Xidian University, China
Feng Shu, Nanjing University of Science and Technology, China
Qinghe Du, Xi'an Jiaotong University, China
Wei Wang, Zhejiang University, China
Publicity Co-Chair:
Guan Gui, Nanjing University of Posts and Telecommunications, China
Liang Xiao, Xiamen University, China
Xiaopeng Yang, Beijing Institute of Technology, China
Gongliang Liu, Harbin Institute of Technology (Weihai), China
Haijun Zhang, University of Science & Technology Beijing, China
Qingquan Sun, California State University San Bernardino, USA
Xiaofei Zhang, Nanjing University of Aeronautics and Astronautics, China
Zilong Liu, Nanyang Technological University, Singapore
Yuan Zhou, Tianjin University, China
Yong Li, Tsinghua University, China
Jingjiang Wang, Qingdao University of Science and Technology, China
Ning Wang, Zhengzhou University, China
YunjianJia, Chongqing University, China
Qingjiang Shi, Nanjing University of Aeronautics and Astronautics, China
Keynote Co-Chairs
Jean X. Gao, University of Texas at Arlington, USA
Shenghong Li, Shanghai Jiaotong University, China
Haibo Zhou, Naijing University, China
Lei Chen, Georgia Southern University, USA
Weijie Xia, Nanjing University of Aeronautics and Astronautics, China
Yong Zeng, National University of Singapore, Singapore
Tingting Zhang, Harbin Institute of Technology (Shenzhen), China
Jun Li, Nanjing University of Science and Technology, China
Jingyu Hua, Zhejiang University of Technology, China
Weigang Chen, Tianjin University, China
Rong Chai, Chongqing University of Posts and Telecommunications
Lusheng Wang, HeFei University of Technology, China
Yanjing Sun, China University of Mining and Technology, China
Rongfei Fan, Beijing Institute of Technology, China
Local Arrangement Co-Chairs:
Mei Nian, Xinjiang
Normal University, China
Zhiming Ma, Xinjiang
Normal University, China
Yong Yang, Xinjiang
Normal University, China
Minglu Jin, Dalian University of Technology, China
Nan Zhao, Dalian University of Technology, China
Xufen Xie, Dalian Polytechnic University, China
Jie wang, Dalian University of Technology, China
Hui Li, Dalian University of Technology, China
Registration & Financial
Co-Chairs:
Xiangwei Qi, Xinjiang
Normal University, China
Haifang Li, Xinjiang
Normal University, China
Liang Han, Tianjin Normal University, China
Xiaonan Zhao, Tianjin
Normal University, China
Yue Wang, Tianjin
Normal University , China
Yi Sun, Dalian University of Technology, China
Yanqing Guo, Dalian University of Technology, China
Ming Li, Dalian University of Technology, China
Bo Wang, Dalian University of Technology, China