CSPS 2020 to go virtual
Dear Authors:
As you may be aware, the World Health Organization
officially declared the novel coronavirus COVID-19 a pandemic. Governments
around the world are now issuing restrictions on travel, gatherings, and
meetings in an effort to limit and slow the spread of the virus.
Following the advice and guidelines from healthcare officials and local authorities, CSPS 2020 will now be held virtually on 4-5 July 2020. Accepted papers for CSPS 2020 will be submitted for inclusion in Conference Proceedings by Springer after they are presented at the virtual conference.
Although CSPS 2020 cannot be held physically, the integrity and quality of the research and content will remain and now be experienced in the virtual environment. Thank you for your support.
Call For Paper
The 9th International Conference on Communications, Signal Processing, and Systems (CSPS)
July 4-5, 2020, Changbaishan, China
Sponsored by:
IEEE Fort Worth Section, USA
IEEE Women in Engineering of Harbin Section, China
University of Texas at Arlington, USA
University of Strathclyde, UK
Huazhong Agricultural University, China
Wuhan University, China
Tianjin Normal University, China
Harbin Institute of Technology, China
Dalian University of Technology, China
Dalian Maritime University, China
University of Electronic Science and Technology, China
Beijing University of Posts and Telecommunications, China
Shanghai Jiaotong University, China
The 9th International Conference on Communications, Signal Processing, and Systems (CSPS) will be held in July 4-5, 2020 in Changbaishan, China. Prospective authors are invited to submit original technical papers for oral or poster presentations at CSPS and publication in the Conference Proceedings. The papers in communications, signal processing, and systems are solicited in the following topics, but are not limited to:
All accepted papers will be published in Lecture Notes in Electrical Engineering, a book series published by Springer, and is indexed by EI-indexed, ISI Proceedings, SCOPUS, MetaPress, Springerlink.